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        • KrF深紫外光刻膠系列

          Kind       型號Performance                    性  能Application                  應  用
          DK1081R:0.18μm,Thickness   range:0.4um-0.8μmAA/Poly/CT
          DK1080R:0.25μm,Thickness   range:0.55μm-1.0μmImplant/AA/CT
          DK1088R:0.25μm,Thickness   range:0.8μm-1.4μmTV/TM/Implant
          DK1089R:0.25μm,Thickness   range:0.8μm-1.4μmTV/TM/Implant
          DK1087R:1μm,Thickness range:3-4μmSpecial application/ PAD
          DK2060R:0.25μm,Thickness:0.55-0.8μmContact/Hole
          DK3030R:0.25μm,Thickness:0.6-0.8μmAA/Metal/Contact/Hole
          DKN1100Krf Negative PR   R:0.20μm,Thickness:0.4-0.8μmSAB/Implant


        • i /g line正膠系列

          Kind         型號Performance                    性  能Application                  應  用
          C7600R:0.30μm,Thickness   range:7000A-12000A0.3um process
          C7500R:0.4μm,Thickness   range:7000A-12000A0.4μm process
          C7510R:0.5μm,Thickness   range:19000A-36000A0.5um process
          C7310R:0.45μm,Thickness:13000A-15000A  0.5μm process
          C8315R:0.65μm,High heat resistance0.65μm process
          C8325R:0.9μm,Thickness:14000A-23000A0.9μm process
          C8350R:1.2μm,Thickness:20000A-35000AMetal/Passivation
          C5315R:0.65μm,Thickness:10000A-17000A0.65μm process
          EP3200AR:1.0μm,Thickness:20000-35000ALED positive   resist


        • Thick Film正膠系列

          Kind        型號Performance                    性  能Application                  應  用
          C6111A1g-i line thick   resist,Thickness:30000-50000AImplant/Passivation
          C6350Ag-i line thick   resist,Thickness:40000-80000APassivation layer
          C6230g-i line thick   resist,Thickness:40000-80000AImplant/Passivation
          C6124A1g-i line thick   resist,Thickness:<11μmLED/Packaging
          CP4800/CP4900For KOH and TMAH base developerPackaging/IGBT
          C9005ICA PR,R:0.8μm,Thickness:3-8μmRDL/TSV


        • lift off負膠系列

          Kind        型號Performance                    性  能Application                  應  用
          EN3120A1R:2μm@4μm,Thickness:4.5-9.5μm,
              High heat resistance
          IC/LED
          E3130ALift off negative resist,High   resolutionIC/LED
          E3260A2/SR:5μm@8μm,<100mj/cm2,Thickness:6-12μmIC/LED
          E3502R:0.6μm@2.4μm,Thickness:2-4μm,Easy   stripIC/LED
          E3510R:6μm@14μm,Thickness:5-20μm,Easy   stripIC/LED
          E3175/BR:2.0μm@3.8μm,Small undercut,Thickness:2-4μmIC/LED


        • BP正膠系列

          Kind        型號Performance                    性  能Application                  應  用
          BP218通用型正膠IC/MEMS
          BP212通用型正膠IC/MEMS


        • 分立器件負膠系列

          Kind        型號Performance                    性  能Application                  應  用
          BN310高分辨負膠分立器件
          BN303通用型負膠分立器件
          BN308高抗蝕負膠分立器件


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